MEAN WELL SPOL-12 series: Non-isolated programmable DC-DC POL regulator - SPOL-12P

Description

SPOL-12P — Non-isolated programmable DC-DC POL regulator

SPOL-12P is a compact MEAN WELL non-isolated point-of-load DC-DC regulator for embedded power systems. Its LGA surface-mount package accepts 3–14.4 V DC and provides an externally programmed 0.6–5.5 V DC output, up to 12 A and 66 W maximum within the input/output and thermal limits. This model uses positive-logic remote ON/OFF control.

Download MEAN WELL SPOL-12 Datasheet (PDF)
Download MEAN WELL EMI Testing Guidance (PDF)

SPOL-12 specifications, control, assembly and packing: PDF pages 11–21.

Model and electrical specifications

Model and package SPOL-12P; SPOL-12 series; non-isolated programmable point-of-load regulator in an ultra-compact Land Grid Array (LGA) surface-mount package.
Input voltage 3–14.4 V DC; normal input 12 V DC.
Start-up and undervoltage Start-up time 30 ms; start-up voltage 3.0 V maximum; undervoltage shutdown 2.6 V typical.
Recommended external fuse 15 A.
Output voltage and capability 0.6–5.5 V DC programmable range; 12 A rated current; 66 W maximum rated power. Maximum current, maximum voltage and power remain subject to the input/output limits and derating.
Input/output operating constraint Vout ≤ Vin − 2 V. Use the set-point area plot on PDF page 15 together with the 3–14.4 V rated input range; the graph does not extend that rated range.
Voltage accuracy ±3%.
Series efficiency Up to 91% at 12 V input. The output-specific typical figures below are measured at normal 12 V DC input, full load and 25°C.
Selection reference at 5.5 V output Input current: 200 mA at no load, 6 A at full load. Typical efficiency 91%; output current up to 12 A. These are operating-point references for the programmable module.
Selection reference at 5 V output Input current: 180 mA at no load, 5.4 A at full load. Typical efficiency 91%; output current up to 12 A. These are operating-point references for the programmable module.
Selection reference at 3.3 V output Input current: 110 mA at no load, 3.8 A at full load. Typical efficiency 88%; output current up to 12 A. These are operating-point references for the programmable module.
Selection reference at 2.5 V output Input current: 80 mA at no load, 2.9 A at full load. Typical efficiency 86%; output current up to 12 A. These are operating-point references for the programmable module.
Selection reference at 1.8 V output Input current: 60 mA at no load, 2.2 A at full load. Typical efficiency 82.5%; output current up to 12 A. These are operating-point references for the programmable module.
Selection reference at 1.5 V output Input current: 50 mA at no load, 1.85 A at full load. Typical efficiency 82%; output current up to 12 A. These are operating-point references for the programmable module.
Selection reference at 1.2 V output Input current: 50 mA at no load, 1.6 A at full load. Typical efficiency 77%; output current up to 12 A. These are operating-point references for the programmable module.
Selection reference at 0.6 V output Input current: 30 mA at no load, 0.93 A at full load. Typical efficiency 65%; output current up to 12 A. These are operating-point references for the programmable module.
Capacitive load and minimum load Maximum capacitor load 200 µF; no minimum load required.
Ripple and noise 50 mVp-p maximum for Vo < 1.2 V DC; for Vo > 1.2 V DC the table specifies 3% of Vo peak-to-peak. The equality point Vo = 1.2 V is not assigned to either condition; confirm the applicable limit with MEAN WELL.
Ripple measurement 20 MHz bandwidth; 12-inch twisted pair terminated with a 0.1 µF capacitor and two 47 µF capacitors; shown at Vout = 1 V DC.
Line regulation ±0.4%; measured from low line to high line at rated load.
Load regulation ±0.2%; measured from 10% to 100% rated load.
Switching frequency 800 kHz typical.
General test conditions Normal input 12 V DC, rated load, ambient 25°C and 70% RH unless an individual condition is stated.

Output adjustment, control and protection

Trim connection and equation Connect Rtrim between Trim pin 6 and SIG_GND pin 13. Rtrim (kΩ) = 12 / (Vo − 0.6), with Vo in volts. The application diagram connects VS+ to the positive load point and VS− to the negative load point.
Trim resistor reference table Vo → Rtrim: 5.5 V → 2.44 kΩ; 5 V → 2.727 kΩ; 3.3 V → 4.444 kΩ; 2.5 V → 6.316 kΩ; 1.8 V → 10 kΩ; 1.5 V → 13.33 kΩ; 1.2 V → 20 kΩ; 0.6 V → open (∞).
Remote ON/OFF Positive logic: power ON with Remote open or 1.6 V ≤ R.C ≤ 5.5 V; power OFF with Remote shorted to GND or a low level up to 0.6 V. In the example circuit, Q1 OFF turns SPOL-12P ON and Q1 ON turns it OFF.
Short-circuit protection Continuous short-circuit protection (no damage), with automatic recovery.
Power Good thresholds P.G ON overvoltage threshold 116.5% of Vo; P.G OFF overvoltage threshold 120% of Vo; P.G ON undervoltage threshold 91% of Vo. P.G low sink current 100 µA at P.G = 0.2 V.
Power Good signal Open-drain P.G goes low during overcurrent, short circuit, UVLO, overvoltage, undervoltage, overtemperature or an unregulated output, including prebias conditions. Use an external pull-up to VDD or another rail; the suggested resistor is 100 kΩ to a supply of 5 V DC or lower. A 20 µs deglitch filter is included.
External synchronization SYNC pin 11 synchronizes switching to the rising edge of an external signal. Confirm the permitted external signal range for the application before driving this input. If synchronization is unused, connect SYNC to GND and the converter runs at its default switching frequency.
Output sequencing connection For master/slave tracking, feed SEQ pin 9 through an external resistive divider using the same scaling ratio as the output-to-reference ratio. The source circuit uses RSEQ, Rtrim and CSEQ referenced to SIG_GND; confirm divider values for the intended output.
Output sequencing timing Allow a minimum recommended 10 ms delay between ON/OFF and the sequencing signal, so soft-start completes before the sequencing ramp. The source describes tracking until the output reaches its set point and calls for the final SEQ voltage to exceed that set point.
Sequenced shutdown Lower SEQ in a controlled manner for simultaneous shutdown. Below the set point the source describes one-to-one tracking. Maintain a valid input voltage until the tracking and output voltages reach ground potential (0 V).

Environment and thermal limits

Cooling and working environment Forced-air convection; −40 to +90°C with derating; 20–90% RH, non-condensing. The working-temperature test uses a 95.4 × 85 mm, 2 oz, two-layer test board.
Ambient-temperature derating Use the separate 20, 100, 300 and 500 LFM curves on PDF page 15. The 20 LFM curve starts at about 80% load, while the higher-airflow curves begin near 100% and derate at different temperatures. The 20 LFM curve reaches zero near 78°C, the 100 LFM curve near 85°C, and both the 300 and 500 LFM curves near 90°C; +90°C is not a full-load rating. Select load from the actual airflow curve, rather than a single temperature limit.
Thermal test conditions Derating curves were measured at 12 V input and 5 V output. No component may exceed 125°C; the specified test-board and airflow conditions must be considered in the final design.
Storage environment −55 to +125°C; 10–95% RH, non-condensing.
Temperature coefficient 0.03%/°C over 0–90°C.
Vibration MIL-STD-202G: 0–55 Hz, 10 G, 1-minute period, 2 hours.

Safety and electromagnetic compatibility

Safety standards and marks LVD BS EN/EN62368-1 approved; the catalog lists EAC TP TC 004 as pending. CE and UKCA marks are shown. Approval and pending status are distinct.
EMC emissions Conducted and radiated BS EN/EN55032 Class A with external components. Apply the model-specific external circuits below and verify the complete equipment.
ESD immunity BS EN/EN61000-4-2, Level 3: ±8 kV air and ±6 kV contact.
EFT and surge immunity EFT/burst: BS EN/EN61000-4-4, Level 3, 2 kV. Surge: BS EN/EN61000-4-5, Level 4, 2 kV. The specified external protection circuit is required.
EFT and surge external circuit Use the PDF page 19 input protection circuit: TVS P4SMAJ13CA and C1 = 10000 µF / 25 V across the input.
Radiated Class A circuit topology The PDF page 19 reference includes an external isolated DC/DC stage before the SPOL-12 module. CMC1 and L1 precede that stage, CMC2 follows it, and Cy1/Cy2 bridge its corresponding input/output sides. Follow the complete drawing; the SPOL-12 module itself remains non-isolated.
Radiated Class A capacitor banks C1 = 220 µF electrolytic; each C2/C3/C4 entry specifies 4.7 µF × 2 MLCC; C5 = 10 µF × 5 MLCC; C6 = 47 µF × 2 MLCC. Cy1 and Cy2 are specified as 2200 pF × 3 MLCC.
Radiated Class A inductors L1 = 3.3 µH; CMC1 = 2.4 mH and CMC2 = 2.1 mH, both CMC T22 × 12 × 8 as listed in the reference circuit.

Mechanical dimensions and pad connections

Dimensions 12.19 × 12.19 × 3.10 mm (0.48 × 0.48 × 0.122 inch); the side drawing marks 3.1 mm maximum overall height and 0.8 mm board thickness. Mechanical tolerance ±0.25 mm.
Pad functions Pin 1 Remote ON/OFF; pin 2 Vin; pins 3 and 7 GND; pin 4 Vout; pin 5 VS+; pin 6 Trim; pin 9 SEQ; pin 10 P.G; pin 11 SYNC; pin 12 VS−; pin 13 SIG_GND; pins 8, 14, 15, 16 and 17 N.C (no connection).
Module pad dimensions Bottom-view pads 2–4: 4 × 1.78 mm; pad 1 and pads 5–17: 1 × 1 mm.
PCB land dimensions Top-view footprint pads 2–4: 4.2 × 1.87 mm; pad 1 and pads 5–17: 1.05 × 1.05 mm. The recommended footprint marks 12.44 mm minimum in both directions.
Mechanical drawing coordinates PDF page 14 uses center axes and local references 4.575, 3.435, 2.285, 1.145, 3.425 and 4.565 mm. Bottom-view module pads and top-view PCB lands are mirrored; use the actual numbered drawing for placement.

Surface-mount assembly and storage

Automated placement Open-frame construction is intended for automated assembly. The manufacturer suggests picking and placing over the inductor; optimize nozzle size, tip style, vacuum pressure and placement speed for the assembly process.
Moisture sensitivity MSL level 3. Follow J-STD-033 for moisture-sensitive surface-mount handling, packing, shipping and use.
Dry packing and floor life Use a moisture-barrier bag with desiccant for MSL 3 or higher and keep it sealed until use. After opening, the listed floor life is 168 hours at ≤30°C and 60% RH. Dry-packed shelf life is at most 12 months from the bag-seal date when stored below 40°C and below 90% RH.
Cleanliness before soldering Keep solder pads clean and handle boards carefully to avoid contamination and excess gas generation when flux reacts with oxides or contaminants.
Lead-free reflow process J-STD-020 moisture/reflow classification; recommended forced-air-convection reflow with Sn/Ag/Cu (SAC) solder paste. Soldering outside the recommended profile requires testing to verify performance.
Reflow preheat 150°C minimum to 200°C maximum preheat temperature, with 60–120 seconds between these temperatures.
Reflow peak and dwell Peak 245°C; 20–40 seconds within 5°C of the peak. Maintain temperature above 217°C for 60–150 seconds.
Reflow ramp limits Average ramp-up from maximum preheat to peak: 3°C/s maximum. Ramp-down from peak to liquidus: 6°C/s maximum. Time from 25°C to peak: 8 minutes maximum.

Applications, reliability and packing

Typical applications Telecom, server and storage equipment, industrial control, distributed power architectures, intermediate-bus applications, renewable energy, battery management systems (BMS) and field-programmable gate arrays (FPGA).
Application examples The SPOL-12 diagrams illustrate industrial-PC rails for hard disk, memory, MCU, display, level shifter, USB and LAN loads, and a green-energy/BMS system with a 12 V input and 5 V rail. These are system examples; the module does not provide the external charger, BMS or communication functions.
Reliability 1132 k hours MTBF, MIL-HDBK-217F at 25°C.
Manufacturer warranty 3 years.
Unit weight 0.8 g per unit as the catalog PACKING reference.
Reel and carton packing 850 converters per 13-inch reel; one box gross weight 1.11 kg; 2 boxes / 1700 converters per carton, gross weight 3 kg.
Packing dimensions Box drawing: 340 × 355 × 43 mm; carton drawing: 125 × 405 × 380 mm. Reel drawing: Ø330 mm outside, Ø100 mm hub, Ø13.15 ±0.35 mm center hole, 30.4 mm maximum width and 2.2 mm local reference.
Carrier tape specification EIA-481-2A; cumulative tolerance over 10 sprocket-hole pitches ±0.2 mm; general dimensions ±0.1 mm unless separately marked. Tape width 24 ±0.3 mm, pocket pitch 20 mm, hole pitch 4 mm, Ø1.5 mm holes (+0.1/−0), thickness 0.4 ±0.05 mm; follow the illustrated unreeling direction.
Carrier tape drawing references PDF packing drawing marks 12.6 mm pocket spans, 11.5, 1.75, 2, 3.6 and 1.4 mm local dimensions, with 6°, 60°, 90° and 10° angle references. Use the dimension endpoints on the packing drawing; these are packaging dimensions, not PCB land dimensions.
Manufacturer packing note The catalog states no minimum order quantity is required for sample orders and asks customers to consolidate tape-package orders where possible. Standard tape quantity is 850 pieces; confirm the actual order and packing quantity with the supplier.

Installation and system verification

Complete-system EMC verification Verify EMC with the converter installed in the final equipment and connected to a representative load. Wiring, assembly and the application affect the result. Follow the model's specified EMC conditions and any required external components; the linked EMI testing guidance does not certify the finished equipment.

MEAN WELL SPOL-12 series: Non-isolated programmable DC-DC POL regulator - SPOL-12P

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SPOL-12P — Non-isolated programmable DC-DC POL regulator SPOL-12P is a compact MEAN WELL non-isolated point-of-load DC-DC regulator for embedded power... Read more

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    Description

    SPOL-12P — Non-isolated programmable DC-DC POL regulator

    SPOL-12P is a compact MEAN WELL non-isolated point-of-load DC-DC regulator for embedded power systems. Its LGA surface-mount package accepts 3–14.4 V DC and provides an externally programmed 0.6–5.5 V DC output, up to 12 A and 66 W maximum within the input/output and thermal limits. This model uses positive-logic remote ON/OFF control.

    Download MEAN WELL SPOL-12 Datasheet (PDF)
    Download MEAN WELL EMI Testing Guidance (PDF)

    SPOL-12 specifications, control, assembly and packing: PDF pages 11–21.

    Model and electrical specifications

    Model and package SPOL-12P; SPOL-12 series; non-isolated programmable point-of-load regulator in an ultra-compact Land Grid Array (LGA) surface-mount package.
    Input voltage 3–14.4 V DC; normal input 12 V DC.
    Start-up and undervoltage Start-up time 30 ms; start-up voltage 3.0 V maximum; undervoltage shutdown 2.6 V typical.
    Recommended external fuse 15 A.
    Output voltage and capability 0.6–5.5 V DC programmable range; 12 A rated current; 66 W maximum rated power. Maximum current, maximum voltage and power remain subject to the input/output limits and derating.
    Input/output operating constraint Vout ≤ Vin − 2 V. Use the set-point area plot on PDF page 15 together with the 3–14.4 V rated input range; the graph does not extend that rated range.
    Voltage accuracy ±3%.
    Series efficiency Up to 91% at 12 V input. The output-specific typical figures below are measured at normal 12 V DC input, full load and 25°C.
    Selection reference at 5.5 V output Input current: 200 mA at no load, 6 A at full load. Typical efficiency 91%; output current up to 12 A. These are operating-point references for the programmable module.
    Selection reference at 5 V output Input current: 180 mA at no load, 5.4 A at full load. Typical efficiency 91%; output current up to 12 A. These are operating-point references for the programmable module.
    Selection reference at 3.3 V output Input current: 110 mA at no load, 3.8 A at full load. Typical efficiency 88%; output current up to 12 A. These are operating-point references for the programmable module.
    Selection reference at 2.5 V output Input current: 80 mA at no load, 2.9 A at full load. Typical efficiency 86%; output current up to 12 A. These are operating-point references for the programmable module.
    Selection reference at 1.8 V output Input current: 60 mA at no load, 2.2 A at full load. Typical efficiency 82.5%; output current up to 12 A. These are operating-point references for the programmable module.
    Selection reference at 1.5 V output Input current: 50 mA at no load, 1.85 A at full load. Typical efficiency 82%; output current up to 12 A. These are operating-point references for the programmable module.
    Selection reference at 1.2 V output Input current: 50 mA at no load, 1.6 A at full load. Typical efficiency 77%; output current up to 12 A. These are operating-point references for the programmable module.
    Selection reference at 0.6 V output Input current: 30 mA at no load, 0.93 A at full load. Typical efficiency 65%; output current up to 12 A. These are operating-point references for the programmable module.
    Capacitive load and minimum load Maximum capacitor load 200 µF; no minimum load required.
    Ripple and noise 50 mVp-p maximum for Vo < 1.2 V DC; for Vo > 1.2 V DC the table specifies 3% of Vo peak-to-peak. The equality point Vo = 1.2 V is not assigned to either condition; confirm the applicable limit with MEAN WELL.
    Ripple measurement 20 MHz bandwidth; 12-inch twisted pair terminated with a 0.1 µF capacitor and two 47 µF capacitors; shown at Vout = 1 V DC.
    Line regulation ±0.4%; measured from low line to high line at rated load.
    Load regulation ±0.2%; measured from 10% to 100% rated load.
    Switching frequency 800 kHz typical.
    General test conditions Normal input 12 V DC, rated load, ambient 25°C and 70% RH unless an individual condition is stated.

    Output adjustment, control and protection

    Trim connection and equation Connect Rtrim between Trim pin 6 and SIG_GND pin 13. Rtrim (kΩ) = 12 / (Vo − 0.6), with Vo in volts. The application diagram connects VS+ to the positive load point and VS− to the negative load point.
    Trim resistor reference table Vo → Rtrim: 5.5 V → 2.44 kΩ; 5 V → 2.727 kΩ; 3.3 V → 4.444 kΩ; 2.5 V → 6.316 kΩ; 1.8 V → 10 kΩ; 1.5 V → 13.33 kΩ; 1.2 V → 20 kΩ; 0.6 V → open (∞).
    Remote ON/OFF Positive logic: power ON with Remote open or 1.6 V ≤ R.C ≤ 5.5 V; power OFF with Remote shorted to GND or a low level up to 0.6 V. In the example circuit, Q1 OFF turns SPOL-12P ON and Q1 ON turns it OFF.
    Short-circuit protection Continuous short-circuit protection (no damage), with automatic recovery.
    Power Good thresholds P.G ON overvoltage threshold 116.5% of Vo; P.G OFF overvoltage threshold 120% of Vo; P.G ON undervoltage threshold 91% of Vo. P.G low sink current 100 µA at P.G = 0.2 V.
    Power Good signal Open-drain P.G goes low during overcurrent, short circuit, UVLO, overvoltage, undervoltage, overtemperature or an unregulated output, including prebias conditions. Use an external pull-up to VDD or another rail; the suggested resistor is 100 kΩ to a supply of 5 V DC or lower. A 20 µs deglitch filter is included.
    External synchronization SYNC pin 11 synchronizes switching to the rising edge of an external signal. Confirm the permitted external signal range for the application before driving this input. If synchronization is unused, connect SYNC to GND and the converter runs at its default switching frequency.
    Output sequencing connection For master/slave tracking, feed SEQ pin 9 through an external resistive divider using the same scaling ratio as the output-to-reference ratio. The source circuit uses RSEQ, Rtrim and CSEQ referenced to SIG_GND; confirm divider values for the intended output.
    Output sequencing timing Allow a minimum recommended 10 ms delay between ON/OFF and the sequencing signal, so soft-start completes before the sequencing ramp. The source describes tracking until the output reaches its set point and calls for the final SEQ voltage to exceed that set point.
    Sequenced shutdown Lower SEQ in a controlled manner for simultaneous shutdown. Below the set point the source describes one-to-one tracking. Maintain a valid input voltage until the tracking and output voltages reach ground potential (0 V).

    Environment and thermal limits

    Cooling and working environment Forced-air convection; −40 to +90°C with derating; 20–90% RH, non-condensing. The working-temperature test uses a 95.4 × 85 mm, 2 oz, two-layer test board.
    Ambient-temperature derating Use the separate 20, 100, 300 and 500 LFM curves on PDF page 15. The 20 LFM curve starts at about 80% load, while the higher-airflow curves begin near 100% and derate at different temperatures. The 20 LFM curve reaches zero near 78°C, the 100 LFM curve near 85°C, and both the 300 and 500 LFM curves near 90°C; +90°C is not a full-load rating. Select load from the actual airflow curve, rather than a single temperature limit.
    Thermal test conditions Derating curves were measured at 12 V input and 5 V output. No component may exceed 125°C; the specified test-board and airflow conditions must be considered in the final design.
    Storage environment −55 to +125°C; 10–95% RH, non-condensing.
    Temperature coefficient 0.03%/°C over 0–90°C.
    Vibration MIL-STD-202G: 0–55 Hz, 10 G, 1-minute period, 2 hours.

    Safety and electromagnetic compatibility

    Safety standards and marks LVD BS EN/EN62368-1 approved; the catalog lists EAC TP TC 004 as pending. CE and UKCA marks are shown. Approval and pending status are distinct.
    EMC emissions Conducted and radiated BS EN/EN55032 Class A with external components. Apply the model-specific external circuits below and verify the complete equipment.
    ESD immunity BS EN/EN61000-4-2, Level 3: ±8 kV air and ±6 kV contact.
    EFT and surge immunity EFT/burst: BS EN/EN61000-4-4, Level 3, 2 kV. Surge: BS EN/EN61000-4-5, Level 4, 2 kV. The specified external protection circuit is required.
    EFT and surge external circuit Use the PDF page 19 input protection circuit: TVS P4SMAJ13CA and C1 = 10000 µF / 25 V across the input.
    Radiated Class A circuit topology The PDF page 19 reference includes an external isolated DC/DC stage before the SPOL-12 module. CMC1 and L1 precede that stage, CMC2 follows it, and Cy1/Cy2 bridge its corresponding input/output sides. Follow the complete drawing; the SPOL-12 module itself remains non-isolated.
    Radiated Class A capacitor banks C1 = 220 µF electrolytic; each C2/C3/C4 entry specifies 4.7 µF × 2 MLCC; C5 = 10 µF × 5 MLCC; C6 = 47 µF × 2 MLCC. Cy1 and Cy2 are specified as 2200 pF × 3 MLCC.
    Radiated Class A inductors L1 = 3.3 µH; CMC1 = 2.4 mH and CMC2 = 2.1 mH, both CMC T22 × 12 × 8 as listed in the reference circuit.

    Mechanical dimensions and pad connections

    Dimensions 12.19 × 12.19 × 3.10 mm (0.48 × 0.48 × 0.122 inch); the side drawing marks 3.1 mm maximum overall height and 0.8 mm board thickness. Mechanical tolerance ±0.25 mm.
    Pad functions Pin 1 Remote ON/OFF; pin 2 Vin; pins 3 and 7 GND; pin 4 Vout; pin 5 VS+; pin 6 Trim; pin 9 SEQ; pin 10 P.G; pin 11 SYNC; pin 12 VS−; pin 13 SIG_GND; pins 8, 14, 15, 16 and 17 N.C (no connection).
    Module pad dimensions Bottom-view pads 2–4: 4 × 1.78 mm; pad 1 and pads 5–17: 1 × 1 mm.
    PCB land dimensions Top-view footprint pads 2–4: 4.2 × 1.87 mm; pad 1 and pads 5–17: 1.05 × 1.05 mm. The recommended footprint marks 12.44 mm minimum in both directions.
    Mechanical drawing coordinates PDF page 14 uses center axes and local references 4.575, 3.435, 2.285, 1.145, 3.425 and 4.565 mm. Bottom-view module pads and top-view PCB lands are mirrored; use the actual numbered drawing for placement.

    Surface-mount assembly and storage

    Automated placement Open-frame construction is intended for automated assembly. The manufacturer suggests picking and placing over the inductor; optimize nozzle size, tip style, vacuum pressure and placement speed for the assembly process.
    Moisture sensitivity MSL level 3. Follow J-STD-033 for moisture-sensitive surface-mount handling, packing, shipping and use.
    Dry packing and floor life Use a moisture-barrier bag with desiccant for MSL 3 or higher and keep it sealed until use. After opening, the listed floor life is 168 hours at ≤30°C and 60% RH. Dry-packed shelf life is at most 12 months from the bag-seal date when stored below 40°C and below 90% RH.
    Cleanliness before soldering Keep solder pads clean and handle boards carefully to avoid contamination and excess gas generation when flux reacts with oxides or contaminants.
    Lead-free reflow process J-STD-020 moisture/reflow classification; recommended forced-air-convection reflow with Sn/Ag/Cu (SAC) solder paste. Soldering outside the recommended profile requires testing to verify performance.
    Reflow preheat 150°C minimum to 200°C maximum preheat temperature, with 60–120 seconds between these temperatures.
    Reflow peak and dwell Peak 245°C; 20–40 seconds within 5°C of the peak. Maintain temperature above 217°C for 60–150 seconds.
    Reflow ramp limits Average ramp-up from maximum preheat to peak: 3°C/s maximum. Ramp-down from peak to liquidus: 6°C/s maximum. Time from 25°C to peak: 8 minutes maximum.

    Applications, reliability and packing

    Typical applications Telecom, server and storage equipment, industrial control, distributed power architectures, intermediate-bus applications, renewable energy, battery management systems (BMS) and field-programmable gate arrays (FPGA).
    Application examples The SPOL-12 diagrams illustrate industrial-PC rails for hard disk, memory, MCU, display, level shifter, USB and LAN loads, and a green-energy/BMS system with a 12 V input and 5 V rail. These are system examples; the module does not provide the external charger, BMS or communication functions.
    Reliability 1132 k hours MTBF, MIL-HDBK-217F at 25°C.
    Manufacturer warranty 3 years.
    Unit weight 0.8 g per unit as the catalog PACKING reference.
    Reel and carton packing 850 converters per 13-inch reel; one box gross weight 1.11 kg; 2 boxes / 1700 converters per carton, gross weight 3 kg.
    Packing dimensions Box drawing: 340 × 355 × 43 mm; carton drawing: 125 × 405 × 380 mm. Reel drawing: Ø330 mm outside, Ø100 mm hub, Ø13.15 ±0.35 mm center hole, 30.4 mm maximum width and 2.2 mm local reference.
    Carrier tape specification EIA-481-2A; cumulative tolerance over 10 sprocket-hole pitches ±0.2 mm; general dimensions ±0.1 mm unless separately marked. Tape width 24 ±0.3 mm, pocket pitch 20 mm, hole pitch 4 mm, Ø1.5 mm holes (+0.1/−0), thickness 0.4 ±0.05 mm; follow the illustrated unreeling direction.
    Carrier tape drawing references PDF packing drawing marks 12.6 mm pocket spans, 11.5, 1.75, 2, 3.6 and 1.4 mm local dimensions, with 6°, 60°, 90° and 10° angle references. Use the dimension endpoints on the packing drawing; these are packaging dimensions, not PCB land dimensions.
    Manufacturer packing note The catalog states no minimum order quantity is required for sample orders and asks customers to consolidate tape-package orders where possible. Standard tape quantity is 850 pieces; confirm the actual order and packing quantity with the supplier.

    Installation and system verification

    Complete-system EMC verification Verify EMC with the converter installed in the final equipment and connected to a representative load. Wiring, assembly and the application affect the result. Follow the model's specified EMC conditions and any required external components; the linked EMI testing guidance does not certify the finished equipment.

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